LPC1313FHN33,551 vs LPC1316FHN33,551

This detailed comparison of LPC1313FHN33,551 and LPC1316FHN33,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1313FHN33,551

NXP Semiconductors

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LPC1316FHN33,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	32-VQFN Exposed Pad	32-VQFN Exposed Pad
Description	IC MCU 32BIT 32KB FLASH 32VQFN	IC MCU 32BIT 48KB FLASH 32HVQFN
In Stock	0	59
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC13xx	LPC13xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	72MHz	72MHz
Connectivity	I²C, Microwire, SPI, SSI, UART/USART	I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals	Brown-out Detect/Reset, POR, WDT	Brown-out Detect/Reset, POR, WDT
Number of I/O	28	26
Program Memory Size	32KB (32K x 8)	48KB (48K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	4K x 8
RAM Size	8K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	2V ~ 3.6V
Data Converters	A/D 8x10b	A/D 8x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	-	32-HVQFN (7x7)