LPC1765FET100,551 vs LPC1810FET100,551

This detailed comparison of LPC1765FET100,551 and LPC1810FET100,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1765FET100,551

LPC1765FET100,551

NXP Semiconductors

LPC1810FET100,551

LPC1810FET100,551

VIGOR

Specifications
Manufacturer NXP Semiconductors VIGOR
Package / Case 100-TFBGA 100-TFBGA
Description IC MCU 32BIT 256KB FLASH 100BGA IC MCU 32BIT ROMLESS 100TFBGA
In Stock 0 774
Mounting Type Surface Mount Surface Mount
Part Status Discontinued at Digi-Key Active
Series LPC17xx LPC18xx
Package Tray Bulk
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit 32-Bit
Speed 100MHz 150MHz
Connectivity CANbus, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 70 64
Program Memory Size 256KB (256K x 8) -
Program Memory Type FLASH ROMless
EEPROM Size - -
RAM Size 64K x 8 136K x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V 2V ~ 3.6V
Data Converters A/D 8x12b; D/A 1x10b A/D 12x10b; D/A 1x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C
Supplier Device Package 100-TFBGA (9x9) 100-TFBGA (9x9)
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