LPC1768FET100Z vs ATSAM3SD8CA-CUR

This detailed comparison of LPC1768FET100Z and ATSAM3SD8CA-CUR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1768FET100Z

NXP Semiconductors

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ATSAM3SD8CA-CUR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	Roving Networks / Microchip Technology
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT 512KB FLSH 100TFBGA	IC MCU 32BIT 512KB FLSH 100TFBGA
In Stock	6 968	3 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	LPC17xx	SAM3S
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	100MHz	64MHz
Connectivity	CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG	EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	70	79
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	64K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	2.4V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 8x12b; D/A 1x10b	A/D 15x10/12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)