LPC1788FET180,551 vs LPC1850FET180,551

This detailed comparison of LPC1788FET180,551 and LPC1850FET180,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1788FET180,551

NXP Semiconductors

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LPC1850FET180,551

VIGOR

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	VIGOR
Package / Case	180-TFBGA	180-TFBGA
Description	IC MCU 32BIT 512KB FLSH 180TFBGA	IC MCU 32BIT ROMLESS 180TFBGA
In Stock	0	70
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC17xx	LPC18xx
Package	Tray	Bulk
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	120MHz	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O	141	118
Program Memory Size	512KB (512K x 8)	-
Program Memory Type	FLASH	ROMless
EEPROM Size	4K x 8	-
RAM Size	96K x 8	200K x 8
Voltage - Supply (Vcc/Vdd)	2.4V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 8x12b; D/A 1x10b	A/D 8x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	180-TFBGA (12x12)	180-TFBGA (12x12)