LPC1820FET100,551 vs ATSAM3U1CB-CU

This detailed comparison of LPC1820FET100,551 and ATSAM3U1CB-CU in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1820FET100,551

NXP Semiconductors

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ATSAM3U1CB-CU

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	Roving Networks / Microchip Technology
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT ROMLESS 100TFBGA	IC MCU 32BIT 64KB FLASH 100TFBGA
In Stock	9	3 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC18xx	SAM3U
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	150MHz	96MHz
Connectivity	CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG	EBI/EMI, I²C, Memory Card, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	64	57
Program Memory Size	-	64KB (64K x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	-
RAM Size	168K x 8	20K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 12x10b; D/A 1x10b	A/D 4x10b, 4x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)