LPC1823JET100551 vs LPC1833JET100E

This detailed comparison of LPC1823JET100551 and LPC1833JET100E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1823JET100551

VIGOR

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LPC1833JET100E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	100-TFBGA	100-TFBGA
Description	LPC1800 - HIGH-PERFORMANCE MICRO	IC MCU 32BIT 512KB FLSH 100TFBGA
In Stock	520	210
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC18xx	LPC18xx
Package	Bulk	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	180MHz	180MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, WDT	Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O	49	49
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	16K x 8	16K x 8
RAM Size	104K x 8	136K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 4x10b; D/A 1x10b	A/D 4x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)