LPC1830FET100Y vs LPC1812JET100E

This detailed comparison of LPC1830FET100Y and LPC1812JET100E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1830FET100Y

NXP Semiconductors

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LPC1812JET100E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT ROMLESS 100TFBGA	IC MCU 32BIT 512KB FLSH 100TFBGA
In Stock	1 993	1 201
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC18xx	LPC18xx
Package	Tape & Reel (TR)	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	180MHz	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG	CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, WDT	Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O	49	49
Program Memory Size	-	512KB (512K x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	16K x 8
RAM Size	200K x 8	104K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 8x10b; D/A 1x10b	A/D 4x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)