LPC1833JET256,551 vs LPC18S50FET256,551

This detailed comparison of LPC1833JET256,551 and LPC18S50FET256,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1833JET256,551

NXP Semiconductors

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LPC18S50FET256,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	256-LBGA	256-LBGA
Description	IC MCU 32BIT 512KB FLASH 256LBGA	IC MCU 32BIT ROMLESS 256LBGA
In Stock	83	10
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC18xx	LPC18xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	180MHz	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O	164	164
Program Memory Size	512KB (512K x 8)	-
Program Memory Type	FLASH	ROMless
EEPROM Size	16K x 8	-
RAM Size	136K x 8	200K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 16x10b; D/A 1x10b	A/D 8x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	256-LBGA (17x17)	256-LBGA (17x17)