LPC1850FET180,551 vs LPC18S50FET180E

This detailed comparison of LPC1850FET180,551 and LPC18S50FET180E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1850FET180,551

VIGOR

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LPC18S50FET180E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	180-TFBGA	180-TFBGA
Description	IC MCU 32BIT ROMLESS 180TFBGA	IC MCU 32BIT ROMLESS 180TFBGA
In Stock	70	189
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC18xx	LPC18xx
Package	Bulk	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	180MHz	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O	118	118
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	200K x 8	200K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 8x10b; D/A 1x10b	A/D 8x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	180-TFBGA (12x12)	180-TFBGA (12x12)