LPC18S37JET100E vs LPC1837JET100E

This detailed comparison of LPC18S37JET100E and LPC1837JET100E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC18S37JET100E

NXP Semiconductors

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LPC1837JET100E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT 1MB FLASH 100TFBGA	IC MCU 32BIT 1MB FLASH 100TFBGA
In Stock	61	105
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC18xx	LPC18xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	180MHz	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB	CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, WDT	Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O	49	49
Program Memory Size	1MB (1M x 8)	1MB (1M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	16K x 8
RAM Size	136K x 8	136K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 4x10b; D/A 1x10b	A/D 4x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)