LPC2210FBD144,551 vs TMS470R1A288PGEA

This detailed comparison of LPC2210FBD144,551 and TMS470R1A288PGEA in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2210FBD144,551

NXP Semiconductors

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TMS470R1A288PGEA

VIGOR

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	VIGOR
Package / Case	144-LQFP	144-LQFP
Description	IC MCU 16/32BIT ROMLESS 144LQFP	IC MCU 16/32B 288KB FLSH 144LQFP
In Stock	0	4 971
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	LPC2200	TMS470
Package	Tray	Bulk
Core Processor	ARM7®	ARM7®
Core Size	16/32-Bit	16/32-Bit
Speed	60MHz	48MHz
Connectivity	EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART	CANbus, C2Slb, I²C, SCI, SPI
Peripherals	POR, PWM, WDT	DMA, PWM, WDT
Number of I/O	76	93
Program Memory Size	-	288KB (288K x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	-
RAM Size	16K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	1.65V ~ 3.6V	1.71V ~ 2.05V
Data Converters	A/D 8x10b	A/D 12x10b
Oscillator Type	Internal	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-LQFP (20x20)	144-LQFP (20x20)