LPC2364FBD100,551 vs LPC2387FBD100K

This detailed comparison of LPC2364FBD100,551 and LPC2387FBD100K in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2364FBD100,551

VIGOR

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LPC2387FBD100K

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	100-LQFP	100-LQFP
Description	IC MCU 16/32B 128KB FLSH 100LQFP	IC MCU 16/32B 512KB FLSH 100LQFP
In Stock	0	2 197
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC2300	LPC2300
Package	Bulk	Bulk
Core Processor	ARM7®	ARM7®
Core Size	16/32-Bit	16/32-Bit
Speed	72MHz	72MHz
Connectivity	CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB	CANbus, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	70	70
Program Memory Size	128KB (128K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	34K x 8	98K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 6x10b; D/A 1x10b	A/D 6x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-LQFP (14x14)	100-LQFP (14x14)