LPC2364FET100,518 vs AT91SAM7XC128-CU-999

This detailed comparison of LPC2364FET100,518 and AT91SAM7XC128-CU-999 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2364FET100,518

NXP Semiconductors

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AT91SAM7XC128-CU-999

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	Roving Networks / Microchip Technology
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 16/32BIT 128KB 100TFBGA	IC MCU 16/32BIT 128KB 100TFBGA
In Stock	56	1 777
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Obsolete
Series	LPC2300	SAM7XC
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)
Core Processor	ARM7®	ARM7®
Core Size	16/32-Bit	16/32-Bit
Speed	72MHz	55MHz
Connectivity	CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB	CANbus, Ethernet, I²C, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	70	62
Program Memory Size	128KB (128K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	34K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	1.65V ~ 1.95V
Data Converters	A/D 6x10b; D/A 1x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)