LPC2420FET208,551 vs LPC2470FET208,551

This detailed comparison of LPC2420FET208,551 and LPC2470FET208,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2420FET208,551

NXP Semiconductors

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LPC2470FET208,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	208-TFBGA	208-TFBGA
Description	IC MCU 16/32BIT ROMLESS 208TFBGA	IC MCU 16/32BIT ROMLESS 208TFBGA
In Stock	21	117
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Not For New Designs
Series	LPC2400	LPC2400
Package	Tray	Tray
Core Processor	ARM7®	ARM7®
Core Size	16/32-Bit	16/32-Bit
Speed	72MHz	72MHz
Connectivity	EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O	160	160
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	82K x 8	98K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 8x10b; D/A 1x10b	A/D 8x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	208-TFBGA (15x15)	208-TFBGA (15x15)