LPC4312JET100E vs LPC4320FET100,551

This detailed comparison of LPC4312JET100E and LPC4320FET100,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC4312JET100E

NXP Semiconductors

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LPC4320FET100,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT 512KB FLSH 100TFBGA	IC MCU 32BIT ROMLESS 100TFBGA
In Stock	260	110
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC43xx	LPC43xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4/M0	ARM® Cortex®-M4/M0
Core Size	32-Bit Dual-Core	32-Bit Dual-Core
Speed	204MHz	204MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART	CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	49	49
Program Memory Size	512KB (512K x 8)	-
Program Memory Type	FLASH	ROMless
EEPROM Size	16K x 8	-
RAM Size	104K x 8	200K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 4x10b; D/A 1x10b	A/D 4x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)