LPC4320FET100,551 vs LPC4312JET100E

This detailed comparison of LPC4320FET100,551 and LPC4312JET100E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC4320FET100,551

NXP Semiconductors

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LPC4312JET100E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT ROMLESS 100TFBGA	IC MCU 32BIT 512KB FLSH 100TFBGA
In Stock	110	260
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC43xx	LPC43xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4/M0	ARM® Cortex®-M4/M0
Core Size	32-Bit Dual-Core	32-Bit Dual-Core
Speed	204MHz	204MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG	CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O	49	49
Program Memory Size	-	512KB (512K x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	16K x 8
RAM Size	200K x 8	104K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 4x10b; D/A 1x10b	A/D 4x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)