LPC54018JET180E vs LPC54616J256ET180E

This detailed comparison of LPC54018JET180E and LPC54616J256ET180E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC54018JET180E

NXP Semiconductors

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LPC54616J256ET180E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	180-TFBGA	180-TFBGA
Description	IC MCU 32BIT ROMLESS 180TFBGA	IC MCU 32BIT 256KB FLSH 180TFBGA
In Stock	140	2 964
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC540xx	LPC546xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	180MHz	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	145	145
Program Memory Size	-	256KB (256K x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	16K x 8
RAM Size	360K x 8	136K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 12x12b	A/D 12x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	180-TFBGA (12x12)	180-TFBGA (12x12)