LPC54S018J4MET180E vs LPC54S018JET180K

This detailed comparison of LPC54S018J4MET180E and LPC54S018JET180K in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC54S018J4MET180E

NXP Semiconductors

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LPC54S018JET180K

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	180-TFBGA	180-TFBGA
Description	IC MCU 32BIT 4MB FLASH 180TFBGA	IC MCU 32BIT ROMLESS 180TFBGA
In Stock	5 802	6 517
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC540xx	LPC540xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	180MHz	180MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O	137	145
Program Memory Size	4MB (4M x 8)	-
Program Memory Type	FLASH	ROMless
EEPROM Size	-	16K x 8
RAM Size	360K x 8	360K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 12x12b	A/D 12x12b SAR
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	180-TFBGA (12x12)	180-TFBGA (12x12)