LPC5512JBD100E vs LPC5516JBD100E

This detailed comparison of LPC5512JBD100E and LPC5516JBD100E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC5512JBD100E

NXP Semiconductors

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LPC5516JBD100E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-LQFP Exposed Pad	100-LQFP Exposed Pad
Description	IC MCU 32BIT 64KB FLASH 100HLQFP	IC MCU 32BIT 256KB FLSH 100HLQFP
In Stock	1 973	143
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC551x	LPC551x
Package	Tray	Tray
Core Processor	ARM® Cortex®-M33	ARM® Cortex®-M33
Core Size	32-Bit	32-Bit
Speed	150MHz	150MHz
Connectivity	CANbus, Flexcomm, I²C, SPI, UART/USART, USB	CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O	64	64
Program Memory Size	64KB (64K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	48K x 8	96K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 10x16b SAR	A/D 10x16b SAR
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	100-HLQFP (14x14)	100-HLQFP (14x14)