LPC55S04JBD64E vs LPC55S06JBD64E

This detailed comparison of LPC55S04JBD64E and LPC55S06JBD64E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC55S04JBD64E

NXP Semiconductors

Request For Quote

LPC55S06JBD64E

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	64-TQFP Exposed Pad	64-TQFP Exposed Pad
Description	IC MCU CORTEX M33 HTQFP63	IC MCU CORTEX M33 HTQFP61
In Stock	500	160
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC55S0x	LPC55S0x
Package	Tray	Tray
Core Processor	ARM® Cortex®-M33	ARM® Cortex®-M33
Core Size	32-Bit	32-Bit
Speed	96MHz	96MHz
Connectivity	CANbus, Flex COMM, I²C, SPI, UART/USART	CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O	45	45
Program Memory Size	128KB (128K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	80K x 8	96K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 9x16b SAR	A/D 9x16b SAR
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	64-HTQFP (10x10)	64-HTQFP (10x10)