LPC55S14JBD100E vs LPC55S26JBD100K

This detailed comparison of LPC55S14JBD100E and LPC55S26JBD100K in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC55S14JBD100E

NXP Semiconductors

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LPC55S26JBD100K

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-LQFP Exposed Pad	100-LQFP Exposed Pad
Description	IC MCU 32BIT 128KB FLSH 100HLQFP	IC MCU 32BIT 256KB FLSH 100HLQFP
In Stock	70	122
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC55S1x	LPC55S2x
Package	Tray	Tray
Core Processor	ARM® Cortex®-M33	ARM® Cortex®-M33
Core Size	32-Bit	32-Bit
Speed	150MHz	150MHz
Connectivity	CANbus, Flexcomm, I²C, SPI, UART/USART, USB	Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	64	64
Program Memory Size	128KB (128K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	80K x 8	144K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 10x16b SAR	A/D 10x16b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	100-HLQFP (14x14)	100-HLQFP (14x14)