LPC55S16JBD100E vs LPC55S66JBD100K

This detailed comparison of LPC55S16JBD100E and LPC55S66JBD100K in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC55S16JBD100E

NXP Semiconductors

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LPC55S66JBD100K

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-LQFP Exposed Pad	100-LQFP Exposed Pad
Description	IC MCU 32BIT 256KB FLSH 100HLQFP	IC MCU 32BIT 256KB FLSH 100HLQFP
In Stock	2 685	7 987
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC55S1x	LPC55S6x
Package	Tray	Tray
Core Processor	ARM® Cortex®-M33	ARM® Cortex®-M33
Core Size	32-Bit	32-Bit
Speed	150MHz	150MHz
Connectivity	CANbus, Flexcomm, I²C, SPI, UART/USART, USB	Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	64	64
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	96K x 8	144K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 10x16b SAR	A/D 10x16b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	100-HLQFP (14x14)	100-HLQFP (14x14)