LPC55S26JBD100K vs LPC5516JBD100E

This detailed comparison of LPC55S26JBD100K and LPC5516JBD100E in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC55S26JBD100K

NXP Semiconductors

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LPC5516JBD100E

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-LQFP Exposed Pad	100-LQFP Exposed Pad
Description	IC MCU 32BIT 256KB FLSH 100HLQFP	IC MCU 32BIT 256KB FLSH 100HLQFP
In Stock	122	143
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC55S2x	LPC551x
Package	Tray	Tray
Core Processor	ARM® Cortex®-M33	ARM® Cortex®-M33
Core Size	32-Bit	32-Bit
Speed	150MHz	150MHz
Connectivity	Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB	CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O	64	64
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	144K x 8	96K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 10x16b	A/D 10x16b SAR
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	100-HLQFP (14x14)	100-HLQFP (14x14)