LPC804M101JDH20J vs STM32L031F6P7

This detailed comparison of LPC804M101JDH20J and STM32L031F6P7 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC804M101JDH20J

LPC804M101JDH20J

NXP Semiconductors

STM32L031F6P7

STM32L031F6P7

STMicroelectronics

Specifications
Manufacturer NXP Semiconductors STMicroelectronics
Package / Case 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP (0.173", 4.40mm Width)
Description IC MCU 32BIT 32KB FLASH 20TSSOP IC MCU 32BIT 32KB FLASH 20TSSOP
In Stock 2 532 3 344
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series LPC80xM STM32L0
Package Tape & Reel (TR) Tray
Core Processor ARM® Cortex®-M0+ ARM® Cortex®-M0+
Core Size 32-Bit 32-Bit
Speed 15MHz 32MHz
Connectivity I²C, SPI, UART/USART I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 17 15
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 1K x 8
RAM Size 4K x 8 8K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 12x12b A/D 10x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 20-TSSOP 20-TSSOP
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