LPC812M101FD20FP vs ATSAMD11D14A-SSNT

This detailed comparison of LPC812M101FD20FP and ATSAMD11D14A-SSNT in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC812M101FD20FP

LPC812M101FD20FP

NXP Semiconductors

ATSAMD11D14A-SSNT

ATSAMD11D14A-SSNT

Roving Networks / Microchip Technology

Specifications
Manufacturer NXP Semiconductors Roving Networks / Microchip Technology
Package / Case 20-SOIC (0.295", 7.50mm Width) 20-SOIC (0.295", 7.50mm Width)
Description IC MCU 32BIT 16KB FLASH 20SO IC MCU 32BIT 16KB FLASH 20SOIC
In Stock 2 590 1 274
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series LPC81xM SAM D11D
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor ARM® Cortex®-M0+ ARM® Cortex®-M0+
Core Size 32-Bit 32-Bit
Speed 30MHz 48MHz
Connectivity I²C, SPI, UART/USART I²C, LINbus, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, WDT
Number of I/O 18 18
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.62V ~ 3.63V
Data Converters - A/D 8x12b; D/A 1x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 20-SO 20-SOIC
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