LPC822M101JDH20J vs LPC812M101JDH20J

This detailed comparison of LPC822M101JDH20J and LPC812M101JDH20J in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC822M101JDH20J

NXP Semiconductors

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LPC812M101JDH20J

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	20-TSSOP (0.173", 4.40mm Width)	20-TSSOP (0.173", 4.40mm Width)
Description	IC MCU 32BIT 16KB FLASH 20TSSOP	IC MCU 32BIT 16KB FLASH 20TSSOP
In Stock	3 376	2 774
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC82x	LPC81xM
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M0+	ARM® Cortex®-M0+
Core Size	32-Bit	32-Bit
Speed	30MHz	30MHz
Connectivity	I²C, SPI, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	16	18
Program Memory Size	16KB (16K x 8)	16KB (16K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	4K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 5x12b	-
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	20-TSSOP	20-TSSOP