LPC822M101JHI33E vs MKE02Z16VFM4

This detailed comparison of LPC822M101JHI33E and MKE02Z16VFM4 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC822M101JHI33E

NXP Semiconductors

Request For Quote

MKE02Z16VFM4

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	32-VFQFN Exposed Pad	32-VFQFN Exposed Pad
Description	IC MCU 32BIT 16KB FLASH 33HVQFN	IC MCU 32BIT 16KB FLASH 32QFN
In Stock	3 866	109
Mounting Type	Surface Mount	Surface Mount
Part Status	Discontinued at Digi-Key	Active
Series	LPC82x	Kinetis KE02
Package	Tray	Tray
Core Processor	ARM® Cortex®-M0+	ARM® Cortex®-M0+
Core Size	32-Bit	32-Bit
Speed	30MHz	40MHz
Connectivity	I²C, SPI, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	LVD, PWM, WDT
Number of I/O	29	28
Program Memory Size	16KB (16K x 8)	16KB (16K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	256 x 8
RAM Size	4K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	2.7V ~ 5.5V
Data Converters	A/D 12x12b	A/D 16x12b; D/A 2x6b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	33-HVQFN (5x5)	32-QFN (5x5)