M2S060-FG676 vs M2S060TS-FG676I

This detailed comparison of M2S060-FG676 and M2S060TS-FG676I in the Embedded - System On Chip (SoC) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

M2S060-FG676

Roving Networks / Microchip Technology

Request For Quote

M2S060TS-FG676I

Roving Networks / Microchip Technology

Request For Quote

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	676-BGA	676-BGA
Description	IC SOC CORTEX-M3 166MHZ 676FBGA	IC SOC CORTEX-M3 166MHZ 676FBGA
In Stock	5 498	3 678
Mounting Type	-	-
Part Status	Active	Active
Series	SmartFusion®2	SmartFusion®2
Package	Tray	Tray
Architecture	MCU, FPGA	MCU, FPGA
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Flash Size	256KB	256KB
RAM Size	64KB	64KB
Peripherals	DDR, PCIe, SERDES	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz	166MHz
Primary Attributes	FPGA - 60K Logic Modules	FPGA - 60K Logic Modules
Operating Temperature	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)
Supplier Device Package	676-FBGA (27x27)	676-FBGA (27x27)