MC705P6ACDWER vs MCR705JP7CDWE

This detailed comparison of MC705P6ACDWER and MCR705JP7CDWE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC705P6ACDWER

MC705P6ACDWER

NXP Semiconductors

MCR705JP7CDWE

MCR705JP7CDWE

Flip Electronics

Specifications
Manufacturer NXP Semiconductors Flip Electronics
Package / Case 28-SOIC (0.295", 7.50mm Width) 28-SOIC (0.295", 7.50mm Width)
Description IC MCU 8BIT 4.5KB OTP 28SOIC MICROCONTROLLER, CMOS
In Stock 2 081 1 440
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series HC05 HC05
Package Tape & Reel (TR) Bulk
Core Processor HC05 HC05
Core Size 8-Bit 8-Bit
Speed 2.1MHz 2.1MHz
Connectivity SIO SIO
Peripherals POR, WDT POR, Temp Sensor, WDT
Number of I/O 21 22
Program Memory Size 4.5KB (4.5K x 8) 6KB (6K x 8)
Program Memory Type OTP OTP
EEPROM Size - -
RAM Size 176 x 8 224 x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 4x8b A/D 4x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SOIC 28-SOIC
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