MC705P6ACDWE vs MCHC705JP7CDWE

This detailed comparison of MC705P6ACDWE and MCHC705JP7CDWE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC705P6ACDWE

NXP Semiconductors

Request For Quote

MCHC705JP7CDWE

Flip Electronics

Request For Quote

Specifications Hide identical items

Manufacturer	NXP Semiconductors	Flip Electronics
Package / Case	28-SOIC (0.295", 7.50mm Width)	28-SOIC (0.295", 7.50mm Width)
Description	IC MCU 8BIT 4.5KB OTP 28SOIC	IC MCU 8BIT 6KB OTP 28SOIC
In Stock	5 613	2 940
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Obsolete
Series	HC05	HC05
Package	Tube	Bulk
Core Processor	HC05	HC05
Core Size	8-Bit	8-Bit
Speed	2.1MHz	2.1MHz
Connectivity	SIO	SIO
Peripherals	POR, WDT	POR, Temp Sensor, WDT
Number of I/O	21	22
Program Memory Size	4.5KB (4.5K x 8)	6KB (6K x 8)
Program Memory Type	OTP	OTP
EEPROM Size	-	-
RAM Size	176 x 8	224 x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 4x8b	A/D 4x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SOIC	28-SOIC