MC9S08AW60MFUE vs MC9S08PA60VQH

This detailed comparison of MC9S08AW60MFUE and MC9S08PA60VQH in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08AW60MFUE

NXP Semiconductors

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MC9S08PA60VQH

VIGOR

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	VIGOR
Package / Case	64-QFP	64-QFP
Description	IC MCU 8BIT 60KB FLASH 64QFP	IC MCU 8BIT 60KB FLASH 64QFP
In Stock	420	15 120
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	S08	S08
Package	Tray	Bulk
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	20MHz
Connectivity	I²C, SCI, SPI	I²C, LINbus, SPI, UART/USART
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	54	57
Program Memory Size	60KB (60K x 8)	60KB (60K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	256 x 8
RAM Size	2K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 16x10b	A/D 16x12b
Oscillator Type	Internal	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	64-QFP (14x14)	64-QFP (14x14)