MC9S08DV32AMLH vs S9S08DZ60F2MLHR

This detailed comparison of MC9S08DV32AMLH and S9S08DZ60F2MLHR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08DV32AMLH

NXP Semiconductors

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S9S08DZ60F2MLHR

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	64-LQFP	64-LQFP
Description	IC MCU 8BIT 32KB FLASH 64LQFP	IC MCU 8BIT 60KB FLASH 64LQFP
In Stock	671	1 095
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	S08	S08
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	40MHz
Connectivity	CANbus, I²C, LINbus, SCI, SPI	CANbus, I²C, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	53	53
Program Memory Size	32KB (32K x 8)	60KB (60K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	2K x 8
RAM Size	2K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 16x12b	A/D 24x12b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	64-LQFP (10x10)	64-LQFP (10x10)