MC9S08GT16ACFDER vs MC9S08GT32ACFDE

This detailed comparison of MC9S08GT16ACFDER and MC9S08GT32ACFDE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08GT16ACFDER

NXP Semiconductors

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MC9S08GT32ACFDE

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	48-VFQFN Exposed Pad	48-VFQFN Exposed Pad
Description	IC MCU 8BIT 16KB FLASH 48QFN	IC MCU 8BIT 32KB FLASH 48QFN
In Stock	300	150
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Not For New Designs
Series	S08	S08
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tray
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	40MHz
Connectivity	I²C, SCI, SPI	I²C, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	39	39
Program Memory Size	16KB (16K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	48-QFN-EP (7x7)	48-QFN-EP (7x7)