MC9S08GT16ACFDE vs MC9S08RE16FDER

This detailed comparison of MC9S08GT16ACFDE and MC9S08RE16FDER in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08GT16ACFDE

NXP Semiconductors

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MC9S08RE16FDER

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	48-VFQFN Exposed Pad	48-VFQFN Exposed Pad
Description	IC MCU 8BIT 16KB FLASH 48QFN	IC MCU 8BIT 16KB FLASH 48QFN
In Stock	2 000	4 040
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Obsolete
Series	S08	S08
Package	Tray	Tape & Reel (TR)
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	8MHz
Connectivity	I²C, SCI, SPI	SCI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	39	39
Program Memory Size	16KB (16K x 8)	16KB (16K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 8x10b	-
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	0°C ~ 70°C (TA)
Supplier Device Package	48-QFN-EP (7x7)	48-QFN-EP (7x7)