MC9S08QG4CFQE vs MC9S08PA4AVDC

This detailed comparison of MC9S08QG4CFQE and MC9S08PA4AVDC in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08QG4CFQE

NXP Semiconductors

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MC9S08PA4AVDC

VIGOR

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	VIGOR
Package / Case	8-VDFN Exposed Pad	8-VDFN Exposed Pad
Description	IC MCU 8BIT 4KB FLASH 8DFN	IC MCU 8BIT 4KB FLASH 8DFN
In Stock	437	3 366
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	S08	S08
Package	Tray	Bulk
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	20MHz	20MHz
Connectivity	I²C, SCI, SPI	LINbus, SPI, UART/USART
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	4	4
Program Memory Size	4KB (4K x 8)	4KB (4K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	128 x 8
RAM Size	256 x 8	512 x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	2.7V ~ 5.5V
Data Converters	A/D 4x10b	A/D 4x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	8-DFN-EP (4x4)	8-DFN (3x3)