MC9S08RD8CPE vs MC9S08SE8CRL

This detailed comparison of MC9S08RD8CPE and MC9S08SE8CRL in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08RD8CPE

NXP Semiconductors

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MC9S08SE8CRL

Flip Electronics

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	Flip Electronics
Package / Case	28-DIP (0.600", 15.24mm)	28-DIP (0.600", 15.24mm)
Description	IC MCU 8BIT 8KB FLASH 28DIP	IC MCU 8BIT 8KB FLASH 28DIP
In Stock	5 281	4 039
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Obsolete
Series	S08	S08
Package	Tube	Bulk
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	8MHz	20MHz
Connectivity	SCI	LINbus, SCI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM
Number of I/O	23	24
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	1K x 8	512 x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	2.7V ~ 5.5V
Data Converters	-	A/D 10x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-PDIP	28-PDIP