MC9S08SH4MTGR vs MC9S08PA4MTGR

This detailed comparison of MC9S08SH4MTGR and MC9S08PA4MTGR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08SH4MTGR

NXP Semiconductors

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MC9S08PA4MTGR

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	16-TSSOP (0.173", 4.40mm Width)	16-TSSOP (0.173", 4.40mm Width)
Description	IC MCU 8BIT 4KB FLASH 16TSSOP	IC MCU 8BIT 4KB FLASH 16TSSOP
In Stock	2 486	3 895
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	S08	S08
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	20MHz
Connectivity	I²C, LINbus, SCI, SPI	LINbus, SPI, UART/USART
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	13	14
Program Memory Size	4KB (4K x 8)	4KB (4K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	128 x 8
RAM Size	256 x 8	512 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 8x10b	A/D 8x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	16-TSSOP	16-TSSOP