MC9S12C32MPBE25 vs MC9S12GC32CPBE

This detailed comparison of MC9S12C32MPBE25 and MC9S12GC32CPBE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S12C32MPBE25

NXP Semiconductors

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MC9S12GC32CPBE

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	52-LQFP	52-LQFP
Description	IC MCU 16BIT 32KB FLASH 52TQFP	IC MCU 16BIT 32KB FLASH 52TQFP
In Stock	793	361
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Active
Series	HCS12	HCS12
Package	Tray	Tray
Core Processor	HCS12	HCS12
Core Size	16-Bit	16-Bit
Speed	25MHz	25MHz
Connectivity	CANbus, EBI/EMI, SCI, SPI	EBI/EMI, SCI, SPI
Peripherals	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	35	35
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	2.35V ~ 5.5V	2.35V ~ 5.5V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	52-TQFP (10x10)	52-TQFP (10x10)