MC9S12E256CPVE vs MC9S12DG256MPVE

This detailed comparison of MC9S12E256CPVE and MC9S12DG256MPVE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S12E256CPVE

NXP Semiconductors

Request For Quote

MC9S12DG256MPVE

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	112-LQFP	112-LQFP
Description	IC MCU 16BIT 256KB FLASH 112LQFP	IC MCU 16BIT 256KB FLASH 112LQFP
In Stock	574	313
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	HCS12	HCS12
Package	Tray	Tray
Core Processor	HCS12	HCS12
Core Size	16-Bit	16-Bit
Speed	25MHz	25MHz
Connectivity	EBI/EMI, I²C, SCI, SPI	CANbus, I²C, SCI, SPI
Peripherals	POR, PWM, WDT	PWM, WDT
Number of I/O	91	91
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	4K x 8
RAM Size	16K x 8	12K x 8
Voltage - Supply (Vcc/Vdd)	2.35V ~ 2.75V	2.35V ~ 5.25V
Data Converters	A/D 16x10b; D/A 2x8b	A/D 16x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	112-LQFP (20x20)	112-LQFP (20x20)