MC9S12XDP512MAL vs S912XDP512J1MALR

This detailed comparison of MC9S12XDP512MAL and S912XDP512J1MALR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S12XDP512MAL

MC9S12XDP512MAL

NXP Semiconductors

S912XDP512J1MALR

S912XDP512J1MALR

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 112-LQFP 112-LQFP
Description IC MCU 16BIT 512KB FLASH 112LQFP IC MCU 16BIT 512KB FLASH 112LQFP
In Stock 195 3 990
Mounting Type Surface Mount Surface Mount
Part Status Active Not For New Designs
Series HCS12X HCS12X
Package Tray Tape & Reel (TR)
Core Processor HCS12X HCS12X
Core Size 16-Bit 16-Bit
Speed 80MHz 80MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, I²C, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 91 91
Program Memory Size 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 4K x 8 4K x 8
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.5V 2.35V ~ 5.5V
Data Converters A/D 16x10b A/D 8x10b, 16x10b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 112-LQFP (20x20) 112-LQFP (20x20)
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