MC9S12XDP512MAL vs S912XEG384BMALR

This detailed comparison of MC9S12XDP512MAL and S912XEG384BMALR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S12XDP512MAL

NXP Semiconductors

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S912XEG384BMALR

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	112-LQFP	112-LQFP
Description	IC MCU 16BIT 512KB FLASH 112LQFP	IC MCU 16BIT 384KB FLASH 112LQFP
In Stock	195	1 323
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	HCS12X	HCS12X
Package	Tray	Tape & Reel (TR)
Core Processor	HCS12X	HCS12X
Core Size	16-Bit	16-Bit
Speed	80MHz	50MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI	CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	91	91
Program Memory Size	512KB (512K x 8)	384KB (384K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	4K x 8	4K x 8
RAM Size	32K x 8	24K x 8
Voltage - Supply (Vcc/Vdd)	2.35V ~ 5.5V	1.72V ~ 5.5V
Data Converters	A/D 16x10b	A/D 16x12b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	112-LQFP (20x20)	112-LQFP (20x20)