MCF5208CAB166 vs MCF5271CAB100

This detailed comparison of MCF5208CAB166 and MCF5271CAB100 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCF5208CAB166

NXP Semiconductors

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MCF5271CAB100

Flip Electronics

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	Flip Electronics
Package / Case	160-BQFP	160-BQFP
Description	IC MCU 32BIT ROMLESS 160QFP	RISC MICROPROCESSOR, 32-BIT, 100
In Stock	500	33 179
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	MCF520x	MCF527x
Package	Tray	Tray
Core Processor	Coldfire V2	Coldfire V2
Core Size	32-Bit	32-Bit
Speed	166.67MHz	100MHz
Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART	EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals	DMA, WDT	DMA, WDT
Number of I/O	50	39
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	16K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	1.4V ~ 3.6V	1.4V ~ 3.6V
Data Converters	-	-
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	160-QFP (28x28)	160-QFP (28x28)