MCF5271CAB100 vs MCF5208CAB166

This detailed comparison of MCF5271CAB100 and MCF5208CAB166 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCF5271CAB100

Flip Electronics

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MCF5208CAB166

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	Flip Electronics	NXP Semiconductors
Package / Case	160-BQFP	160-BQFP
Description	RISC MICROPROCESSOR, 32-BIT, 100	IC MCU 32BIT ROMLESS 160QFP
In Stock	33 179	500
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	MCF527x	MCF520x
Package	Tray	Tray
Core Processor	Coldfire V2	Coldfire V2
Core Size	32-Bit	32-Bit
Speed	100MHz	166.67MHz
Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART	EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals	DMA, WDT	DMA, WDT
Number of I/O	39	50
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	64K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	1.4V ~ 3.6V	1.4V ~ 3.6V
Data Converters	-	-
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	160-QFP (28x28)	160-QFP (28x28)