MCHC705JP7CDWE vs MC705P6ACDWER

This detailed comparison of MCHC705JP7CDWE and MC705P6ACDWER in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCHC705JP7CDWE

MCHC705JP7CDWE

Flip Electronics

MC705P6ACDWER

MC705P6ACDWER

NXP Semiconductors

Specifications
Manufacturer Flip Electronics NXP Semiconductors
Package / Case 28-SOIC (0.295", 7.50mm Width) 28-SOIC (0.295", 7.50mm Width)
Description IC MCU 8BIT 6KB OTP 28SOIC IC MCU 8BIT 4.5KB OTP 28SOIC
In Stock 2 940 2 081
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series HC05 HC05
Package Bulk Tape & Reel (TR)
Core Processor HC05 HC05
Core Size 8-Bit 8-Bit
Speed 2.1MHz 2.1MHz
Connectivity SIO SIO
Peripherals POR, Temp Sensor, WDT POR, WDT
Number of I/O 22 21
Program Memory Size 6KB (6K x 8) 4.5KB (4.5K x 8)
Program Memory Type OTP OTP
EEPROM Size - -
RAM Size 224 x 8 176 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 4x12b A/D 4x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SOIC 28-SOIC
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