MCIMX6L7DVN10AC vs MCIMX6L8DVN10AC

This detailed comparison of MCIMX6L7DVN10AC and MCIMX6L8DVN10AC in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCIMX6L7DVN10AC

NXP Semiconductors

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MCIMX6L8DVN10AC

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	432-TFBGA	432-TFBGA
Description	I.MX6 SL ROM ENHANCE	I.MX 6SL ROM PERF ENHAN
In Stock	4 103	2 913
Mounting Type	-	-
Part Status	Active	Active
Series	i.MX6SL	i.MX6SL
Package	Tray	Tray
Core Processor	ARM® Cortex®-A9	ARM® Cortex®-A9
Number of Cores/Bus Width	1 Core, 32-Bit	1 Core, 32-Bit
Speed	1.0GHz	1.0GHz
Co-Processors/DSP	Multimedia; NEON™ SIMD	Multimedia; NEON™ SIMD
RAM Controllers	LPDDR2, LVDDR3, DDR3	LPDDR2, LVDDR3, DDR3
Graphics Acceleration	Yes	Yes
Display & Interface Controllers	Keypad, LCD	Keypad, LCD
Ethernet	10/100Mbps (1)	10/100Mbps (1)
SATA	-	-
USB	USB 2.0 + PHY (3)	USB 2.0 + PHY (3)
Voltage - I/O	1.2V, 1.8V, 3.0V	1.2V, 1.8V, 3.0V
Operating Temperature	0°C ~ 95°C (TJ)	0°C ~ 95°C (TJ)
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Supplier Device Package	432-MAPBGA (13x13)	432-MAPBGA (13x13)