MCV-X6DB vs MYC-C7Z010-4E1D-667-I

This detailed comparison of MCV-X6DB and MYC-C7Z010-4E1D-667-I in the Embedded - Microcontroller, Microprocessor, FPGA Modules provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCV-X6DB

ARIES Embedded

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MYC-C7Z010-4E1D-667-I

MYIR Tech Limited

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Specifications Hide identical items

Manufacturer	ARIES Embedded	MYIR Tech Limited
Package / Case	-	-
Description	SOM CYCLONEV SOC-FPGA	ARM XILINX ZYNQ-7010 SOM, 1GB DD
In Stock	1 347	233
Mounting Type	-	-
Part Status	Active	Active
Series	-	Zynq®-7000
Package	Box	Box
Module/Board Type	MPU, FPGA Core	MCU, FPGA
Core Processor	ARM® Cortex®-A9	ARM® Cortex®-A9
Co-Processor	-	Zynq-7000 (Z-7010)
Speed	800MHz	667MHz
Flash Size	4GB	32MB
RAM Size	1GB	1GB
Connector Type	Board-to-Board (BTB) Socket - 360	Board-to-Board (BTB) Socket - 280
Size / Dimension	2.91" x 1.65" (74mm x 42mm)	2.95" x 2.17" (75mm x 55mm)
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C