This detailed comparison of MIMX8ML6CVNKZAB and MIMX8ML6DVNLZAB in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
|---|---|---|
| Package / Case | 486-LFBGA | 486-LFBGA |
| Description | IC I.MX 8M PLUS QUAD BGA | IC I.MX 8M PLUS QUAD BGA |
| In Stock | 5 000 | 1 139 |
| Mounting Type | - | - |
| Part Status | Active | Active |
| Series | i.MX8ML | i.MX8ML |
| Package | Tray | Tray |
| Core Processor | ARM® Cortex®-A53 | ARM® Cortex®-A53 |
| Number of Cores/Bus Width | 4 Core, 64-Bit | 4 Core, 64-Bit |
| Speed | 1.8GHz | 1.8GHz |
| Co-Processors/DSP | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP |
| RAM Controllers | DDR4, LPDDR4 | DDR4, LPDDR4 |
| Graphics Acceleration | Yes | Yes |
| Display & Interface Controllers | HTML, LVDS, MIPI-CSI, MIPI-DSI | HTML, LVDS, MIPI-CSI, MIPI-DSI |
| Ethernet | GbE (2) | GbE (2) |
| SATA | - | - |
| USB | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | USB 2.0 + PHY (2), USB 3.0 + PHY (2) |
| Voltage - I/O | - | - |
| Operating Temperature | -40°C ~ 105°C (TJ) | 0°C ~ 95°C (TJ) |
| Security Features | ARM TZ, CAAM, RDC | ARM TZ, CAAM, RDC |
| Supplier Device Package | 486-LFBGA (14x14) | 486-LFBGA (14x14) |