MK26FN2M0VMI18 vs MK27FN2M0VMI15

This detailed comparison of MK26FN2M0VMI18 and MK27FN2M0VMI15 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MK26FN2M0VMI18

NXP Semiconductors

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MK27FN2M0VMI15

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	169-LFBGA	169-LFBGA
Description	IC MCU 32BIT 2MB FLASH 169MAPBGA	IC MCU 32BIT 2MB FLASH 169MAPBGA
In Stock	2 201	4 350
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Discontinued at Digi-Key
Series	Kinetis K20	Kinetis K27F
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	180MHz	150MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG	EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals	DMA, I²S, LVD, POR, PWM, WDT	DMA, I²S, PWM, WDT
Number of I/O	116	120
Program Memory Size	2MB (2M x 8)	2MB (2M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	256K x 8	1M x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 5x12b, 6x16b; D/A 2x12b	A/D 16b SAR; D/A 2x6b, 1x12b
Oscillator Type	Internal	External, Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	169-MAPBGA (9x9)	169-MAPBGA (9x9)