MK51DN256CMD10 vs MK53DX256CMD10

This detailed comparison of MK51DN256CMD10 and MK53DX256CMD10 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MK51DN256CMD10

NXP Semiconductors

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MK53DX256CMD10

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	144-LBGA	144-LBGA
Description	IC MCU 32B 256KB FLASH 144MAPBGA	IC MCU 32BIT 256KB FLASH 144BGA
In Stock	160	160
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Kinetis K50	Kinetis K50
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	100MHz	100MHz
Connectivity	EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG	EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals	DMA, I²S, LCD, LVD, POR, PWM, WDT	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O	94	94
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	4K x 8
RAM Size	64K x 8	128K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 41x16b; D/A 2x12b	A/D 41x16b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-MAPBGA (13x13)	144-MAPBGA (13x13)