MK60DN512VMC10 vs MK60DX256VMC10

This detailed comparison of MK60DN512VMC10 and MK60DX256VMC10 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MK60DN512VMC10

NXP Semiconductors

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MK60DX256VMC10

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	121-LFBGA	121-LFBGA
Description	IC MCU 32B 512KB FLASH 121MAPBGA	IC MCU 32B 256KB FLASH 121MAPBGA
In Stock	100	336
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Kinetis K60	Kinetis K60
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	100MHz	100MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals	DMA, I²S, LVD, POR, PWM, WDT	DMA, I²S, LVD, POR, PWM, WDT
Number of I/O	86	86
Program Memory Size	512KB (512K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	4K x 8
RAM Size	128K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 38x16b; D/A 2x12b	A/D 38x16b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	121-MAPBGA (8x8)	121-MAPBGA (8x8)